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1 : $0.0585
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Rochester Electronics FLV110
LED RED DIFFUSED T1 3/4 TH
Manufacturer # :FLV110
Manufacturer :Rochester Electronics
Dasenic # :FLV110-DS
Datasheet :
FLV110 Datasheet
FLV110 DatasheetCustomer # :
Description : LED RED DIFFUSED T1 3/4 TH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0585 | $ 0.06 |
| 25+ | $ 0.0573 | $ 1.43 |
| 100+ | $ 0.0550 | $ 5.5 |
| 500+ | $ 0.0527 | $ 26.35 |
| 1000+ | $ 0.0498 | $ 49.8 |
In Stock: 23903
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0585
Total :$ 0.06
Delivery :
Payment :
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FLV110 information
Rochester Electronics FLV110 technical specifications, attributes, parameters.
- Category:Optoelectronics Devices/LED Indication - Discrete
- Product Status:Active
- Color:Red
- Features:-
- Mounting Type:Through Hole
- Package / Case:Radial
- Size / Dimension:-
- Height ( Max):-
- Supplier Device Package:T-1 3/4
- Configuration:-
- Current - Test:10mA
- Voltage - Forward ( Vf) ( Typ):1.6V
- Millicandela Rating:3mcd
- Wavelength - Peak:660nm
- Viewing Angle:35°
- Lens Color:Red
- Lens Transparency:Diffused
- Lens Style:Round with Domed Top
- Lens Size:5mm, T-1 3/4
- Wavelength - Dominant:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FLV110 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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