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Rochester Electronics FGB3236-F085
Manufacturer # :FGB3236-F085
Manufacturer :Rochester Electronics
Dasenic # :FGB3236-F085-DS
Datasheet : FGB3236-F085 Datasheet
Customer # :
Description : IGBT, 360V, 27A, ECOSPARK II, N-
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 26880
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.935
Total :$ 1.94
Delivery :
Payment :
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FGB3236-F085 information
Rochester Electronics FGB3236-F085 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-40°C ~ 175°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
- Input Type:Logic
- Power - Max:187 W
- Supplier Device Package:D2PAK (TO-263)
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):44 A
- Voltage - Collector Emitter Breakdown ( Max):360 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:1.4V @ 4V, 6A
- Current - Collector Pulsed ( Icm):-
- Switching Energy:-
- Gate Charge:20 nC
- Td (on/off) @ 25° C:-/5.4µs
- Test Condition:300V, 1kOhm, 5V
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FGB3236-F085 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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