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Rochester Electronics FGA25S125P

IGBT, 50A, 1250V, N-CHANNEL
part number has RoHS
Manufacturer # :FGA25S125P
Manufacturer :Rochester Electronics
Dasenic # :FGA25S125P-DS
Customer # :
Description : IGBT, 50A, 1250V, N-CHANNEL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 3.3066$ 33.07
450+$ 2.7555$ 1239.98
In Stock: 1806
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.3066
Total :$ 3.31
Delivery :
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Payment :
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FGA25S125P information

  • Rochester Electronics FGA25S125P technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:Through Hole
  • Package / Case:TO-3P-3, SC-65-3
  • Input Type:Standard
  • Power - Max:250 W
  • Supplier Device Package:TO-3PN
  • Reverse Recovery Time (trr):-
  • Current - Collector ( Ic) ( Max):50 A
  • Voltage - Collector Emitter Breakdown ( Max):1250 V
  • I G B T Type:Trench Field Stop
  • Vce(on) ( Max) @ Vge, Ic:2.35V @ 15V, 25A
  • Current - Collector Pulsed ( Icm):75 A
  • Switching Energy:-
  • Gate Charge:204 nC
  • Td (on/off) @ 25° C:-
  • Test Condition:-
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8541.29.0095
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FGA25S125P provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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