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Rochester Electronics FFB3904

0.2A, 40V, 2-ELEMENT, NPN
part number has RoHS
Manufacturer # :FFB3904
Manufacturer :Rochester Electronics
Dasenic # :FFB3904-DS
Customer # :
Description : 0.2A, 40V, 2-ELEMENT, NPN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0682$ 0.07
25+$ 0.0669$ 1.67
100+$ 0.0642$ 6.42
500+$ 0.0614$ 30.7
1000+$ 0.0580$ 58
In Stock: 12247
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0682
Total :$ 0.07
Delivery :
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Payment :
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FFB3904 information

  • Rochester Electronics FFB3904 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:6-TSSOP, SC-88, SOT-363
  • Power - Max:300mW
  • Supplier Device Package:SC-88 (SC-70-6)
  • Transistor Type:2 NPN (Dual)
  • Current - Collector ( Ic) ( Max):200mA
  • Voltage - Collector Emitter Breakdown ( Max):40V
  • Vce Saturation ( Max) @ Ib, Ic:300mV @ 5mA, 50mA
  • Current - Collector Cutoff ( Max):-
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:100 @ 10mA, 1V
  • Frequency - Transition:250MHz
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FFB3904 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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