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Rochester Electronics FDZ3N513ZT
Manufacturer # :FDZ3N513ZT
Manufacturer :Rochester Electronics
Dasenic # :FDZ3N513ZT-DS
Datasheet : FDZ3N513ZT Datasheet
Customer # :
Description : MOSFET P-CH 30V 1.1A 4WLCSP
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In Stock: 30563
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3022
Total :$ 0.30
Delivery :
Payment :
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FDZ3N513ZT information
Rochester Electronics FDZ3N513ZT technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:4-XFBGA, WLCSP
- Technology:MOSFET (Metal Oxide)
- Supplier Device Package:4-WLCSP (1x1)
- Power Dissipation ( Max):1W (Ta)
- F E T Type:P-Channel
- F E T Feature:Schottky Diode (Isolated)
- Drain to Source Voltage ( Vdss):30 V
- Current - Continuous Drain ( Id) @ 25° C:1.1A
- Rds On ( Max) @ Id, Vgs:462mOhm @ 300mA, 4.5V
- Vgs(th) ( Max) @ Id:1.5V @ 250µA
- Gate Charge ( Qg) ( Max) @ Vgs:1 nC @ 4.5 V
- Input Capacitance ( Ciss) ( Max) @ Vds:85 pF @ 15 V
- Drive Voltage ( Max Rds On, Min Rds On):-
- Vgs ( Max):+5.5V, -300mV
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FDZ3N513ZT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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