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Rochester Electronics FDG330P

MOSFET P-CH 12V 2A SC88
part number has RoHS
Manufacturer # :FDG330P
Manufacturer :Rochester Electronics
Dasenic # :FDG330P-DS
Customer # :
Description : MOSFET P-CH 12V 2A SC88
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0202$ 0.02
In Stock: 47562
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0202
Total :$ 0.02
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FDG330P information

  • Rochester Electronics FDG330P technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:6-TSSOP, SC-88, SOT-363
  • Technology:MOSFET (Metal Oxide)
  • Supplier Device Package:SC-88 (SC-70-6)
  • Power Dissipation ( Max):480mW (Ta)
  • F E T Type:P-Channel
  • F E T Feature:-
  • Drain to Source Voltage ( Vdss):12 V
  • Current - Continuous Drain ( Id) @ 25° C:2A (Ta)
  • Rds On ( Max) @ Id, Vgs:110mOhm @ 2A, 4.5V
  • Vgs(th) ( Max) @ Id:1.5V @ 250µA
  • Gate Charge ( Qg) ( Max) @ Vgs:7 nC @ 4.5 V
  • Input Capacitance ( Ciss) ( Max) @ Vds:477 pF @ 6 V
  • Drive Voltage ( Max Rds On, Min Rds On):-
  • Vgs ( Max):±8V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FDG330P provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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