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Onsemi FBA42060B5
MODULE SPM 600V 20A DIP-023
Manufacturer # :FBA42060B5
Manufacturer :Onsemi
Dasenic # :FBA42060B5-DS
Datasheet :
FBA42060B5 Datasheet
FBA42060B5 DatasheetCustomer # :
Description : MODULE SPM 600V 20A DIP-023
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 10.0620 | $ 10.06 |
| 25+ | $ 9.8640 | $ 246.6 |
| 100+ | $ 9.4590 | $ 945.9 |
| 500+ | $ 9.0540 | $ 4527 |
| 1000+ | $ 8.5500 | $ 8550 |
In Stock: 6885
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.062
Total :$ 10.06
Delivery :
Payment :
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FBA42060B5 information
Onsemi FBA42060B5 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Power Driver Modules
- Product Status:Active
- Mounting Type:Through Hole
- Package / Case:26-PowerDIP Module (1.024", 26.00mm)
- Type:IGBT
- Configuration:1 Phase
- Voltage:600 V
- Current:20 A
- Voltage - Isolation:2000Vrms
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FBA42060B5 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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