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Rochester Electronics EGP10A

RECTIFIER DIODE, 1A, 50V, DO-41
part number has RoHS
Manufacturer # :EGP10A
Manufacturer :Rochester Electronics
Dasenic # :EGP10A-DS
Customer # :
Description : RECTIFIER DIODE, 1A, 50V, DO-41
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0585$ 0.06
25+$ 0.0573$ 1.43
100+$ 0.0550$ 5.5
500+$ 0.0527$ 26.35
1000+$ 0.0498$ 49.8
In Stock: 20836
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0585
Total :$ 0.06
Delivery :
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EGP10A information

  • Rochester Electronics EGP10A technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
  • Product Status:Active
  • Mounting Type:Through Hole
  • Package / Case:DO-204AL, DO-41, Axial
  • Supplier Device Package:DO-204AL (DO-41)
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Diode Type:Standard
  • Current - Average Rectified ( Io):1A
  • Voltage - Forward ( Vf) ( Max) @ If:950 mV @ 1 A
  • Current - Reverse Leakage @ Vr:5 µA @ 50 V
  • Capacitance @ Vr, F:22pF @ 4V, 1MHz
  • Voltage - D C Reverse ( Vr) ( Max):50 V
  • Reverse Recovery Time (trr):-
  • Operating Temperature - Junction:-65°C ~ 150°C
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EGP10A provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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