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Rochester Electronics CD4027BCN

IC FF JK TYPE DUAL 1BIT 16DIP
part number has RoHS
Manufacturer # :CD4027BCN
Manufacturer :Rochester Electronics
Dasenic # :CD4027BCN-DS
Customer # :
Description : IC FF JK TYPE DUAL 1BIT 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
128+$ 2.1150$ 270.72
In Stock: 4230
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.115
Total :$ 2.12
Delivery :
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Payment :
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CD4027BCN information

  • Rochester Electronics CD4027BCN technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Flip Flops
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:16-DIP (0.300", 7.62mm)
  • Type:JK Type
  • Output Type:Complementary
  • Supplier Device Package:16-PDIP
  • Number of Elements:2
  • Voltage - Supply:3V ~ 15V
  • Clock Frequency:15.5 MHz
  • Number of Bits per Element:1
  • Current - Output High, Low:8.8mA, 8.8mA
  • Max Propagation Delay @ V, Max C L:130ns @ 15V, 50pF
  • Current - Quiescent ( Iq):4 µA
  • Trigger Type:Positive Edge
  • Input Capacitance:5 pF
  • Function:Set(Preset) and Reset
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CD4027BCN provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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