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  • Rochester Electronics BAV19

    RECTIFIER DIODE
  • part number has RoHS
  • Mfr.Part # :BAV19
  • Manufacturer :Rochester Electronics
  • Dasenic # :BAV19-DS
  • Datasheet :pdf download BAV19 Datasheet
  • Description : RECTIFIER DIODE
  • Package :-
  • Quantity :
    Unit Price : $ 0.0285Total : $ 0.03
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 52537
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
25 +$ 0.0285$ 0.71
100 +$ 0.0171$ 1.71
500 +$ 0.0153$ 7.65
5000 +$ 0.0136$ 68.00
15000 +$ 0.0122$ 183.00

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Rochester Electronics BAV19 technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
Product Status:Obsolete
Mounting Type:Through Hole
Package / Case:DO-204AH, DO-35, Axial
Supplier Device Package:DO-35 (DO-204AH)
Speed:Small Signal =< 200mA (Io), Any Speed
Diode Type:Standard
Current - Average Rectified ( Io):200mA
Voltage - Forward ( Vf) ( Max) @ If:1.25 V @ 200 mA
Current - Reverse Leakage @ Vr:100 nA @ 100 V
Capacitance @ Vr, F:5pF @ 0V, 1MHz
Voltage - D C Reverse ( Vr) ( Max):120 V
Reverse Recovery Time (trr):50 ns
Operating Temperature - Junction:175°C (Max)
EU RoHS Status:ROHS3 Compliant
US ECCN:EAR99
HTS US:8541.10.0070
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BAV19 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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