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1 : $72.2700
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Onsemi AR1820HSSC12SHEA0-DP1
IMAGE SENSOR CMOS 18MP IBGA60
Manufacturer # :AR1820HSSC12SHEA0-DP1
Manufacturer :Onsemi
Dasenic # :AR1820HSSC12SHEA0-DP1-DS
Datasheet :
AR1820HSSC12SHEA0-DP1 Datasheet
AR1820HSSC12SHEA0-DP1 DatasheetCustomer # :
Description : IMAGE SENSOR CMOS 18MP IBGA60 60-LBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 72.2700 | $ 72.27 |
| 5+ | $ 61.3314 | $ 306.66 |
| 10+ | $ 72.2700 | $ 722.7 |
| 25+ | $ 52.0114 | $ 1300.29 |
| 40+ | $ 49.5614 | $ 1982.46 |
In Stock: 1608
MOQ :1 PCS
Packaging :60-LBGA
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 72.27
Total :$ 72.27
Delivery :
Payment :
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AR1820HSSC12SHEA0-DP1 information
Onsemi AR1820HSSC12SHEA0-DP1 technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
- Product Status:Active
- Operating Temperature:-
- Package / Case:60-LBGA
- Type:CMOS
- Supplier Device Package:60-IBGA (10x10)
- Voltage - Supply:-
- Frames per Second:24
- Pixel Size:1.25µm x 1.25µm
- Active Pixel Array:-
AR1820HSSC12SHEA0-DP1 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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