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Onsemi AR0331SRSC00SUCA0-DPBR1

IMAGE SENSOR 3.1MP 1/3 CIS
part number has RoHS
Manufacturer # :AR0331SRSC00SUCA0-DPBR1
Manufacturer :Onsemi
Dasenic # :AR0331SRSC00SUCA0-DPBR1-DS
Customer # :
Description : IMAGE SENSOR 3.1MP 1/3 CIS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 18.6287$ 18.63
10+$ 17.4809$ 174.81
25+$ 16.8069$ 420.17
50+$ 16.1751$ 808.76
100+$ 15.8380$ 1583.8
In Stock: 1739
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.6287
Total :$ 18.63
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AR0331SRSC00SUCA0-DPBR1 information

  • Onsemi AR0331SRSC00SUCA0-DPBR1 technical specifications, attributes, parameters.
  • Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
  • Product Status:Active
  • Operating Temperature:-30°C ~ 85°C
  • Package / Case:48-LCC
  • Type:CMOS
  • Supplier Device Package:48-iLCC (10x10)
  • Voltage - Supply:1.8V, 2.8V
  • Frames per Second:60
  • Pixel Size:2.2µm x 2.2µm
  • Active Pixel Array:2048H x 1536V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AR0331SRSC00SUCA0-DPBR1 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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