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Onsemi AR0130CSSC00SPCA0-DPBR2

1.2 MP 1/3 CIS
part number has RoHS
Manufacturer # :AR0130CSSC00SPCA0-DPBR2
Manufacturer :Onsemi
Dasenic # :AR0130CSSC00SPCA0-DPBR2-DS
Customer # :
Description : 1.2 MP 1/3 CIS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 78.0000$ 78
5+$ 68.0000$ 340
10+$ 62.0000$ 620
20+$ 58.0000$ 1160
In Stock: 1520
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 78
Total :$ 78.00
Delivery :
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AR0130CSSC00SPCA0-DPBR2 information

  • Onsemi AR0130CSSC00SPCA0-DPBR2 technical specifications, attributes, parameters.
  • Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
  • Product Status:Last Time Buy
  • Operating Temperature:-30°C ~ 70°C (TA)
  • Package / Case:48-LCC
  • Type:CMOS
  • Supplier Device Package:48-iLCC (10x10)
  • Voltage - Supply:1.7V ~ 1.95V, 2.5V ~ 3.1V
  • Frames per Second:60
  • Pixel Size:3.75µm x 3.75µm
  • Active Pixel Array:1280H x 960V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AR0130CSSC00SPCA0-DPBR2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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