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Rochester Electronics 74LCX374WM
Manufacturer # :74LCX374WM
Manufacturer :Rochester Electronics
Dasenic # :74LCX374WM-DS
Datasheet : 74LCX374WM Datasheet
Customer # :
Description : IC FF D-TYPE SNGL 8BIT 20SOIC
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In Stock: 5574
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4485
Total :$ 0.45
Delivery :
Payment :
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74LCX374WM information
Rochester Electronics 74LCX374WM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.295", 7.50mm Width)
- Type:D-Type
- Output Type:Tri-State, Non-Inverted
- Supplier Device Package:20-SOIC
- Number of Elements:1
- Voltage - Supply:2V ~ 3.6V
- Clock Frequency:150 MHz
- Number of Bits per Element:8
- Current - Output High, Low:24mA, 24mA
- Max Propagation Delay @ V, Max C L:8.5ns @ 3.3V, 50pF
- Current - Quiescent ( Iq):10 µA
- Trigger Type:Positive Edge
- Input Capacitance:7 pF
- Function:Standard
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
74LCX374WM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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