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Rochester Electronics 74AUP1G56L6X

MAJORITY LOGIC GATE, AUP/ULP/V S
part number has RoHS
Manufacturer # :74AUP1G56L6X
Manufacturer :Rochester Electronics
Dasenic # :74AUP1G56L6X-DS
Customer # :
Description : MAJORITY LOGIC GATE, AUP/ULP/V S
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1289$ 0.13
25+$ 0.1263$ 3.16
100+$ 0.1211$ 12.11
500+$ 0.1160$ 58
1000+$ 0.1095$ 109.5
In Stock: 43228
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1289
Total :$ 0.13
Delivery :
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Payment :
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74AUP1G56L6X information

  • Rochester Electronics 74AUP1G56L6X technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Gates and Inverters - Multi-Function, Configurable
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:6-UFDFN
  • Output Type:Single-Ended
  • Supplier Device Package:6-MicroPak
  • Number of Circuits:1
  • Voltage - Supply:0.8V ~ 3.6V
  • Number of Inputs:3
  • Logic Type:Configurable Multiple Function
  • Current - Output High, Low:-, 4mA
  • Schmitt Trigger Input:Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74AUP1G56L6X provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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