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Rochester Electronics P2041NXN7MMC

QORIQ INTEGRATED PROCESSOR
part number has RoHS
Manufacturer # :P2041NXN7MMC
Manufacturer :Rochester Electronics
Dasenic # :P2041NXN7MMC-DS
Customer # :
Description : QORIQ INTEGRATED PROCESSOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
25+$ 529.7400$ 13243.5
In Stock: 1895
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 529.74
Total :$ 529.74
Delivery :
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P2041NXN7MMC information

  • Rochester Electronics P2041NXN7MMC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Package / Case:780-BBGA, FCBGA
  • Supplier Device Package:780-FCPBGA (23x23)
  • Voltage - I/ O:1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
  • Speed:1.2GHz
  • Core Processor:PowerPC e500mc
  • Number of Cores/ Bus Width:4 Core, 32-Bit
  • Co- Processors/ D S P:-
  • R A M Controllers:DDR3, DDR3L
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10/100/1000Mbps (5), 10Gbps (1)
  • S A T A:SATA 3Gbps (2)
  • U S B:USB 2.0 + PHY (2)
  • Security Features:-
  • US ECCN:5A002A1 FRE
  • HTS US:8542.31.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
P2041NXN7MMC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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