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1 : $60.3093
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Rochester Electronics P1015NSE5FFB
QORIQ, POWER ARCH 32-BIT SOC, 66
Manufacturer # :P1015NSE5FFB
Manufacturer :Rochester Electronics
Dasenic # :P1015NSE5FFB-DS
Datasheet :
P1015NSE5FFB Datasheet
P1015NSE5FFB DatasheetCustomer # :
Description : QORIQ, POWER ARCH 32-BIT SOC, 66
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 60.3093 | $ 60.31 |
In Stock: 1620
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 60.3093
Total :$ 60.31
Delivery :
Payment :
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P1015NSE5FFB information
Rochester Electronics P1015NSE5FFB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Active
- Operating Temperature:0°C ~ 125°C (TA)
- Package / Case:561-FBGA
- Supplier Device Package:561-TEPBGA I (23x23)
- Voltage - I/ O:-
- Speed:667MHz
- Core Processor:PowerPC e500v2
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:Security; SEC 3.3
- R A M Controllers:DDR3
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (3)
- S A T A:-
- U S B:USB 2.0 + PHY (2)
- Security Features:Cryptography, Random Number Generator
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
P1015NSE5FFB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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