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1 : $159.2200
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Rochester Electronics P1012NSN2HFB
QORIQ INTEGRATED PROCESSOR
Manufacturer # :P1012NSN2HFB
Manufacturer :Rochester Electronics
Dasenic # :P1012NSN2HFB-DS
Datasheet :
P1012NSN2HFB Datasheet
P1012NSN2HFB DatasheetCustomer # :
Description : QORIQ INTEGRATED PROCESSOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 100+ | $ 159.2200 | $ 15922 |
In Stock: 593
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 159.22
Total :$ 159.22
Delivery :
Payment :
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P1012NSN2HFB information
Rochester Electronics P1012NSN2HFB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:0°C ~ 125°C (TA)
- Package / Case:689-BBGA Exposed Pad
- Supplier Device Package:689-TEPBGA II (31x31)
- Voltage - I/ O:-
- Speed:800MHz
- Core Processor:PowerPC e500v2
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:Communications; QUICC Engine
- R A M Controllers:DDR2, DDR3
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (3)
- S A T A:-
- U S B:USB 2.0 + PHY (2)
- Security Features:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
P1012NSN2HFB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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