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Rochester Electronics NX3P191UK,012

IC PWR SWITCH HI SIDE LOG 4WLCSP
part number has RoHS
Manufacturer # :NX3P191UK,012
Manufacturer :Rochester Electronics
Dasenic # :NX3P191UK,012-DS
Customer # :
Description : IC PWR SWITCH HI SIDE LOG 4WLCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2048$ 0.2
25+$ 0.2007$ 5.02
100+$ 0.1925$ 19.25
500+$ 0.1843$ 92.15
1000+$ 0.1741$ 174.1
In Stock: 6590
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2048
Total :$ 0.20
Delivery :
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Payment :
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NX3P191UK,012 information

  • Rochester Electronics NX3P191UK,012 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
  • Product Status:Active
  • Operating Temperature:-
  • Features:-
  • Mounting Type:-
  • Package / Case:-
  • Input Type:-
  • Output Type:-
  • Interface:-
  • Supplier Device Package:-
  • Ratio - Input: Output:-
  • Voltage - Supply ( Vcc/ Vdd):-
  • Number of Outputs:-
  • Fault Protection:-
  • Output Configuration:-
  • Rds On ( Typ):-
  • Voltage - Load:-
  • Current - Output ( Max):-
  • Switch Type:-
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • EU RoHS Status:RoHS Compliant
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NX3P191UK,012 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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