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Rochester Electronics MSC8251TAG1000B

DSP, 32-BIT SIZE, CMOS, PBGA783
part number has RoHS
Manufacturer # :MSC8251TAG1000B
Manufacturer :Rochester Electronics
Dasenic # :MSC8251TAG1000B-DS
Customer # :
Description : DSP, 32-BIT SIZE, CMOS, PBGA783
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 95.8680$ 95.87
25+$ 93.9510$ 2348.78
100+$ 90.1170$ 9011.7
500+$ 86.2830$ 43141.5
1000+$ 81.4860$ 81486
In Stock: 1561
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 95.868
Total :$ 95.87
Delivery :
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MSC8251TAG1000B information

  • Rochester Electronics MSC8251TAG1000B technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:783-BBGA, FCBGA
  • Type:SC3850 Single Core
  • Interface:Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Supplier Device Package:783-FCPBGA (29x29)
  • Clock Rate:1GHz
  • Non- Volatile Memory:ROM (96kB)
  • On- Chip R A M:576kB
  • Voltage - I/ O:2.50V
  • Voltage - Core:1.00V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MSC8251TAG1000B provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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