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Rochester Electronics MSC8157ESVT1000A

DSP, 0-EXT BIT, 667MHZ, CMOS, PB
part number has RoHS
Manufacturer # :MSC8157ESVT1000A
Manufacturer :Rochester Electronics
Dasenic # :MSC8157ESVT1000A-DS
Customer # :
Description : DSP, 0-EXT BIT, 667MHZ, CMOS, PB
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 211.9320$ 211.93
25+$ 207.6930$ 5192.33
100+$ 199.2150$ 19921.5
500+$ 190.7370$ 95368.5
1000+$ 180.1440$ 180144
In Stock: 4110
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 211.932
Total :$ 211.93
Delivery :
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MSC8157ESVT1000A information

  • Rochester Electronics MSC8157ESVT1000A technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:783-BBGA, FCBGA
  • Type:SC3850 Six Core
  • Interface:Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Supplier Device Package:783-FCPBGA (29x29)
  • Clock Rate:1GHz
  • Non- Volatile Memory:ROM (96kB)
  • On- Chip R A M:6.375MB
  • Voltage - I/ O:1.00V, 1.50V, 2.50V
  • Voltage - Core:1.00V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MSC8157ESVT1000A provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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