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Rochester Electronics MSC8156ESAG1000B

DIGITAL SIGNAL PROCESSOR, 32-BIT
part number has RoHS
Manufacturer # :MSC8156ESAG1000B
Manufacturer :Rochester Electronics
Dasenic # :MSC8156ESAG1000B-DS
Customer # :
Description : DIGITAL SIGNAL PROCESSOR, 32-BIT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 245.5650$ 245.57
25+$ 240.6510$ 6016.28
100+$ 230.8320$ 23083.2
500+$ 221.0130$ 110506.5
1000+$ 208.7280$ 208728
In Stock: 1536
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 245.565
Total :$ 245.56
Delivery :
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Payment :
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MSC8156ESAG1000B information

  • Rochester Electronics MSC8156ESAG1000B technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 105°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:783-BBGA, FCBGA
  • Type:SC3850 Six Core
  • Interface:Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Supplier Device Package:783-FCPBGA (29x29)
  • Clock Rate:1GHz
  • Non- Volatile Memory:ROM (96kB)
  • On- Chip R A M:576kB
  • Voltage - I/ O:2.50V
  • Voltage - Core:1.00V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MSC8156ESAG1000B provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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