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Rochester Electronics MPC880ZP66

POWERQUICC RISC MICROPROCESSOR,
part number has RoHS
Manufacturer # :MPC880ZP66
Manufacturer :Rochester Electronics
Dasenic # :MPC880ZP66-DS
Customer # :
Description : POWERQUICC RISC MICROPROCESSOR,
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 29.6190$ 29.62
25+$ 29.0250$ 725.63
100+$ 27.8460$ 2784.6
500+$ 26.6580$ 13329
1000+$ 25.1730$ 25173
In Stock: 1632
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 29.619
Total :$ 29.62
Delivery :
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Payment :
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MPC880ZP66 information

  • Rochester Electronics MPC880ZP66 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:0°C ~ 95°C (TA)
  • Package / Case:357-BBGA
  • Supplier Device Package:357-PBGA (25x25)
  • Voltage - I/ O:3.3V
  • Speed:66MHz
  • Core Processor:MPC8xx
  • Number of Cores/ Bus Width:1 Core, 32-Bit
  • Co- Processors/ D S P:Communications; CPM
  • R A M Controllers:DRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10Mbps (2), 10/100Mbps (2)
  • S A T A:-
  • U S B:USB 2.0 (1)
  • Security Features:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MPC880ZP66 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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