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Rochester Electronics MCZ33999EK
Manufacturer # :MCZ33999EK
Manufacturer :Rochester Electronics
Dasenic # :MCZ33999EK-DS
Datasheet : MCZ33999EK Datasheet
Customer # :
Description : SIPO BASED PERIPHERAL DRIVER, 16
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3063
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.432
Total :$ 9.43
Delivery :
Payment :
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MCZ33999EK information
Rochester Electronics MCZ33999EK technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Features:PWM Input
- Mounting Type:Surface Mount
- Package / Case:54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Input Type:-
- Output Type:N-Channel
- Interface:SPI
- Supplier Device Package:54-SOIC-EP
- Ratio - Input: Output:1:16
- Voltage - Supply ( Vcc/ Vdd):3.1V ~ 5.5V
- Number of Outputs:16
- Fault Protection:Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Output Configuration:Low Side
- Rds On ( Typ):550mOhm
- Voltage - Load:5V ~ 27V
- Current - Output ( Max):900mA
- Switch Type:General Purpose
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MCZ33999EK provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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