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Rochester Electronics MC13191FC

RF AND BASEBAND CIRCUIT, BICMOS,
part number has RoHS
Manufacturer # :MC13191FC
Manufacturer :Rochester Electronics
Dasenic # :MC13191FC-DS
Customer # :
Description : RF AND BASEBAND CIRCUIT, BICMOS,
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.8340$ 3.83
25+$ 3.7530$ 93.83
100+$ 3.6000$ 360
500+$ 3.4470$ 1723.5
1000+$ 3.2580$ 3258
In Stock: 1622
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.834
Total :$ 3.83
Delivery :
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Payment :
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MC13191FC information

  • Rochester Electronics MC13191FC technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Transceiver ICs
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-VFQFN Exposed Pad
  • Frequency:2.4GHz
  • Type:TxRx Only
  • Sensitivity:-92dBm
  • Supplier Device Package:32-QFN (5x5)
  • Data Rate ( Max):250kbps
  • Memory Size:-
  • Voltage - Supply:2V ~ 3.4V
  • Power - Output:4dBm
  • Protocol:-
  • Serial Interfaces:SPI
  • R F Family/ Standard:General ISM > 1GHz
  • Current - Receiving:37mA
  • Modulation:DSSS, O-QPSK
  • G P I O:7
  • Current - Transmitting:30mA
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC13191FC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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