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Rochester Electronics MC100ES6226FA

LOW SKEW CLOCK DRIVER, 100E SERI
part number has RoHS
Manufacturer # :MC100ES6226FA
Manufacturer :Rochester Electronics
Dasenic # :MC100ES6226FA-DS
Customer # :
Description : LOW SKEW CLOCK DRIVER, 100E SERI
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 9.4950$ 9.5
25+$ 9.3060$ 232.65
100+$ 8.9280$ 892.8
500+$ 8.5500$ 4275
1000+$ 8.0730$ 8073
In Stock: 1720
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.495
Total :$ 9.49
Delivery :
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Payment :
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MC100ES6226FA information

  • Rochester Electronics MC100ES6226FA technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:0°C ~ 110°C
  • Mounting Type:Surface Mount
  • Package / Case:32-LQFP
  • Type:Fanout Buffer (Distribution), Divider
  • Supplier Device Package:32-LQFP (7x7)
  • Frequency - Max:3 GHz
  • Number of Circuits:1
  • Output:LVCMOS, LVPECL
  • Voltage - Supply:2.375V ~ 3.465V
  • Input:LVPECL
  • Ratio - Input: Output:1:9
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC100ES6226FA provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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