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Rochester Electronics BFU768F,115

BFU768F - NPN WIDEBAND SILICON G
part number has RoHS
Manufacturer # :BFU768F,115
Manufacturer :Rochester Electronics
Dasenic # :BFU768F,115-DS
Customer # :
Description : BFU768F - NPN WIDEBAND SILICON G
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1408$ 0.14
25+$ 0.1380$ 3.45
100+$ 0.1323$ 13.23
500+$ 0.1267$ 63.35
1000+$ 0.1196$ 119.6
In Stock: 23957
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1408
Total :$ 0.14
Delivery :
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Payment :
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BFU768F,115 information

  • Rochester Electronics BFU768F,115 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - RF
  • Product Status:Obsolete
  • Operating Temperature:150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:SOT-343F
  • Power - Max:220mW
  • Supplier Device Package:4-DFP
  • Transistor Type:NPN
  • Current - Collector ( Ic) ( Max):70mA
  • Voltage - Collector Emitter Breakdown ( Max):2.8V
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:155 @ 10mA, 2V
  • Frequency - Transition:-
  • Noise Figure (d B Typ @ f):-
  • Gain:13.1dB
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.21.0095
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BFU768F,115 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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