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Rochester Electronics 1N5062
RECTIFIER DIODE
Manufacturer # :1N5062
Manufacturer :Rochester Electronics
Dasenic # :1N5062-DS
Datasheet :
1N5062 Datasheet
1N5062 DatasheetCustomer # :
Description : RECTIFIER DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0218 | $ 0.02 |
| 10+ | $ 0.0123 | $ 0.12 |
In Stock: 44944
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0218
Total :$ 0.02
Delivery :
Payment :
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1N5062 information
Rochester Electronics 1N5062 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
- Product Status:Active
- Mounting Type:Through Hole
- Package / Case:SOD-57, Axial
- Supplier Device Package:SOD-57
- Speed:Standard Recovery >500ns, > 200mA (Io)
- Diode Type:Standard
- Current - Average Rectified ( Io):3A
- Voltage - Forward ( Vf) ( Max) @ If:1.1 V @ 2 A
- Current - Reverse Leakage @ Vr:5 µA @ 800 V
- Capacitance @ Vr, F:40pF @ 0V, 1MHz
- Voltage - D C Reverse ( Vr) ( Max):800 V
- Reverse Recovery Time (trr):4 µs
- Operating Temperature - Junction:-55°C ~ 175°C
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- HTS US:8541.10.0000
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
1N5062 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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