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1 : $0.0780
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Rochester Electronics PLVA2665A,215
ZENER DIODE
Manufacturer # :PLVA2665A,215
Manufacturer :Rochester Electronics
Dasenic # :PLVA2665A,215-DS
Datasheet :
PLVA2665A,215 Datasheet
PLVA2665A,215 DatasheetCustomer # :
Description : ZENER DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0780 | $ 0.08 |
| 25+ | $ 0.0765 | $ 1.91 |
| 100+ | $ 0.0734 | $ 7.34 |
| 500+ | $ 0.0702 | $ 35.1 |
| 1000+ | $ 0.0663 | $ 66.3 |
In Stock: 50676
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.078
Total :$ 0.08
Delivery :
Payment :
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PLVA2665A,215 information
Rochester Electronics PLVA2665A,215 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Zener - Arrays
- Product Status:Obsolete
- Tolerance:-
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Power - Max:250 mW
- Supplier Device Package:SOT-23
- Configuration:1 Pair Common Anode
- Voltage - Forward ( Vf) ( Max) @ If:900 mV @ 10 mA
- Current - Reverse Leakage @ Vr:-
- Voltage - Zener ( Nom) ( Vz):6.5 V
- Impedance ( Max) ( Zzt):100 Ohms
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
PLVA2665A,215 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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