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Rochester Electronics PDTC143EMB,315

PDTC143EMB - NPN RESISTOR-EQUIPP
part number has RoHS
Manufacturer # :PDTC143EMB,315
Manufacturer :Rochester Electronics
Dasenic # :PDTC143EMB,315-DS
Customer # :
Description : PDTC143EMB - NPN RESISTOR-EQUIPP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0231$ 0.02
25+$ 0.0227$ 0.57
100+$ 0.0218$ 2.18
500+$ 0.0208$ 10.4
1000+$ 0.0196$ 19.6
In Stock: 48495
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0231
Total :$ 0.02
Delivery :
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Payment :
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PDTC143EMB,315 information

  • Rochester Electronics PDTC143EMB,315 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single, Pre-Biased
  • Product Status:Active
  • Mounting Type:-
  • Package / Case:-
  • Power - Max:-
  • Supplier Device Package:-
  • Transistor Type:-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • Vce Saturation ( Max) @ Ib, Ic:-
  • Current - Collector Cutoff ( Max):-
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:-
  • Frequency - Transition:-
  • Resistor - Base ( R1):-
  • Resistor - Emitter Base ( R2):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
PDTC143EMB,315 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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