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Rochester Electronics BZB84-C75,215

NEXPERIA BZB84-C75 - DUAL ZENER
part number has RoHS
Manufacturer # :BZB84-C75,215
Manufacturer :Rochester Electronics
Dasenic # :BZB84-C75,215-DS
Customer # :
Description : NEXPERIA BZB84-C75 - DUAL ZENER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0197$ 0.02
25+$ 0.0194$ 0.49
100+$ 0.0185$ 1.85
500+$ 0.0177$ 8.85
1000+$ 0.0167$ 16.7
In Stock: 31118
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0197
Total :$ 0.02
Delivery :
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BZB84-C75,215 information

  • Rochester Electronics BZB84-C75,215 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Zener - Arrays
  • Product Status:Active
  • Tolerance:±5%
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:TO-236-3, SC-59, SOT-23-3
  • Power - Max:300 mW
  • Supplier Device Package:TO-236AB
  • Configuration:1 Pair Common Anode
  • Voltage - Forward ( Vf) ( Max) @ If:900 mV @ 10 mA
  • Current - Reverse Leakage @ Vr:50 nA @ 52.5 V
  • Voltage - Zener ( Nom) ( Vz):75 V
  • Impedance ( Max) ( Zzt):255 Ohms
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.10.0050
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BZB84-C75,215 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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