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Rochester Electronics BZB84-C68,215
NOW NEXPERIA BZB84-C68 - ZENER D
Manufacturer # :BZB84-C68,215
Manufacturer :Rochester Electronics
Dasenic # :BZB84-C68,215-DS
Datasheet :
BZB84-C68,215 Datasheet
BZB84-C68,215 DatasheetCustomer # :
Description : NOW NEXPERIA BZB84-C68 - ZENER D
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0197 | $ 0.02 |
| 25+ | $ 0.0194 | $ 0.49 |
| 100+ | $ 0.0185 | $ 1.85 |
| 500+ | $ 0.0177 | $ 8.85 |
| 1000+ | $ 0.0167 | $ 16.7 |
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0197
Total :$ 0.02
Delivery :
Payment :
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BZB84-C68,215 information
Rochester Electronics BZB84-C68,215 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Zener - Arrays
- Product Status:Active
- Tolerance:±5%
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Power - Max:300 mW
- Supplier Device Package:TO-236AB
- Configuration:1 Pair Common Anode
- Voltage - Forward ( Vf) ( Max) @ If:900 mV @ 10 mA
- Current - Reverse Leakage @ Vr:50 nA @ 47.6 V
- Voltage - Zener ( Nom) ( Vz):68 V
- Impedance ( Max) ( Zzt):240 Ohms
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BZB84-C68,215 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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