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Rochester Electronics BUK6209-30C,118
Manufacturer # :BUK6209-30C,118
Manufacturer :Rochester Electronics
Dasenic # :BUK6209-30C,118-DS
Datasheet : BUK6209-30C,118 Datasheet
Customer # :
Description : MOSFET N-CH 30V 50A DPAK
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In Stock: 14400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.195
Total :$ 0.20
Delivery :
Payment :
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BUK6209-30C,118 information
Rochester Electronics BUK6209-30C,118 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 175°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
- Technology:MOSFET (Metal Oxide)
- Supplier Device Package:DPAK
- Power Dissipation ( Max):80W (Ta)
- F E T Type:N-Channel
- F E T Feature:-
- Drain to Source Voltage ( Vdss):30 V
- Current - Continuous Drain ( Id) @ 25° C:50A (Ta)
- Rds On ( Max) @ Id, Vgs:9.8mOhm @ 12A, 10V
- Vgs(th) ( Max) @ Id:2.8V @ 1mA
- Gate Charge ( Qg) ( Max) @ Vgs:30.5 nC @ 10 V
- Input Capacitance ( Ciss) ( Max) @ Vds:1760 pF @ 25 V
- Drive Voltage ( Max Rds On, Min Rds On):-
- Vgs ( Max):±16V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BUK6209-30C,118 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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