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Rochester Electronics 74LVC573ABQ,115
74LVC573A - OCTAL D-TYPE TRANSPA
Manufacturer # :74LVC573ABQ,115
Manufacturer :Rochester Electronics
Dasenic # :74LVC573ABQ,115-DS
Datasheet :
74LVC573ABQ,115 Datasheet
74LVC573ABQ,115 DatasheetCustomer # :
Description : 74LVC573A - OCTAL D-TYPE TRANSPA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.1298 | $ 0.13 |
| 25+ | $ 0.1272 | $ 3.18 |
| 100+ | $ 0.1220 | $ 12.2 |
| 500+ | $ 0.1168 | $ 58.4 |
| 1000+ | $ 0.1103 | $ 110.3 |
In Stock: 38138
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1298
Total :$ 0.13
Delivery :
Payment :
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74LVC573ABQ,115 information
Rochester Electronics 74LVC573ABQ,115 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Latches
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:20-VFQFN Exposed Pad
- Output Type:Tri-State
- Supplier Device Package:20-DHVQFN (4.5x2.5)
- Voltage - Supply:1.2V ~ 3.6V
- Logic Type:D-Type Transparent Latch
- Current - Output High, Low:24mA, 24mA
- Circuit:8:8
- Independent Circuits:1
- Delay Time - Propagation:1.5ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
74LVC573ABQ,115 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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