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Rochester Electronics 74AVC1T1022DPJ

74AVC1T1022 - 1-TO-4 FAN-OUT BUF
part number has RoHS
Manufacturer # :74AVC1T1022DPJ
Manufacturer :Rochester Electronics
Dasenic # :74AVC1T1022DPJ-DS
Customer # :
Description : 74AVC1T1022 - 1-TO-4 FAN-OUT BUF
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1597$ 0.16
25+$ 0.1565$ 3.91
100+$ 0.1501$ 15.01
500+$ 0.1437$ 71.85
1000+$ 0.1357$ 135.7
In Stock: 40230
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1597
Total :$ 0.16
Delivery :
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Payment :
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74AVC1T1022DPJ information

  • Rochester Electronics 74AVC1T1022DPJ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:10-TSSOP
  • Frequency - Max:-
  • Number of Circuits:1
  • Output:Clock
  • Voltage - Supply:0.8V ~ 3.6V
  • Input:Clock
  • Ratio - Input: Output:1:4
  • Differential - Input: Output:No/No
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74AVC1T1022DPJ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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