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Murata Electronics 935246521437-T3T

Silicon RF Capacitors / Thin Film Low profile, High temperature, Wirebonding
part number has RoHS
Manufacturer # :935246521437-T3T
Manufacturer :Murata Electronics
Dasenic # :935246521437-T3T-DS
Customer # :
Description : Silicon RF Capacitors / Thin Film Low profile, High temperature, Wirebonding
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 19.3836$ 193.84
1000+$ 12.9224$ 12922.4
In Stock: 1174
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 19.3836
Total :$ 19.38
Delivery :
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Payment :
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935246521437-T3T information

  • Murata Electronics 935246521437-T3T technical specifications, attributes, parameters.
  • Category:Passive Components/Silicon RF Capacitors / Thin Film
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
935246521437-T3T provided by Murata Electronics
Founded in 1944, Murata Manufacturing Co., Ltd. (TYO: 6981) is a worldwide leader in the design, manufacture, and sale of ceramic-based passive electronic components & solutions, communication modules, and power supply modules. Our primary products include Capacitors, Inductors/EMI filters, High-frequency devices and communication modules, Batteries, and power supplies, as well as Functional devices. Murata's electronic components and modules contribute to enriching people’s lives through their use in all sorts of electronic devices in everyday life, including televisions, PCs, and smartphones. Murata will also continue offering new value as an innovator in growing electronics fields such as communications, mobility, environment, and wellness. Headquartered in Kyoto, Japan, the company boasts a global presence with employees and manufacturing facilities spanning the world. Murata is committed to the development of advanced electronic materials and leading-edge, multi-functional, high-density modules.
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