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MultiDimension Technology(MDT) - USB21023

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MultiDimension Technology(MDT) USB21023

Name: USB21023
Brand: MultiDimension Technology(MDT)
SKU: USB21023-DS
Price: 558.0000 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 1235

MOQ: 1

1 Price Tiers

Mfr.Part # :USB21023
Manufacturer :MultiDimension Technology(MDT)
Dasenic # :USB21023-DS
Datasheet : USB21023 Datasheet PDF
Description : 3D MAGNETOMETER LOW-FIELD USB
Package :-
Unit Price: $558.0000
Total: $558.00

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1-1	$558.0000	-

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MultiDimension Technology(MDT) USB21023 technical specifications, attributes, parameters.

Category:Sensor Devices/Magnetic Sensors - Compass, Magnetic Field (Modules)

Product Status:Active

Operating Temperature:-40°C ~ 85°C (TA)

Package / Case:Probe

Type:Digital Magnetometer

Interface:I²C, USB 2.0

Resolution:-

Axis:X, Y, Z

Measuring Range:±100 Gauss

For Measuring:Strength, Direction of Magnetic Field

EU RoHS Status:RoHS Compliant

REACH Status:REACH is not affected

US ECCN:EAR99

China RoHS Status:Green Symbol: Green and environmentally friendly product

USB21023 provided by MultiDimension Technology(MDT)

MultiDimension Technology (MDT) is a magnetic sensor (TMR/GMR/AMR) manufacturer founded in 2010, and headquartered in Suzhou, Jiangsu Province. MDT has branches in Ningbo Zhejiang, Shenzhen, Chengdu Sichuan, San Jose USA, and Osaka Japan, with its sales network all over the world. With over 500 patents, more than 200 magnetic sensor lineup, and advanced TMR/GMR/AMR magnetic sensor mass production foundry, MDT can provide various high-performance magnetic sensors and diversified solutions for our customers. With the advanced mass production fab and the proven wafer fabrication process for magnetic sensors, MDT is capable of supplying high performance magnetic sensors in large volume to meet diverse application needs. MDT is able to supply packaged chip as well as in whole wafer, die, or chip-on-board format of magnetic sensors (TMR/GMR/AMR) to customers. In addition, MDT can provide customized service options for magnetic sensor design, wafer fabrication and testing.