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Rochester Electronics PC28F160C3BD70A

IC FLASH 16MBIT PAR 64EASYBGA
part number has RoHS
Manufacturer # :PC28F160C3BD70A
Manufacturer :Rochester Electronics
Dasenic # :PC28F160C3BD70A-DS
Customer # :
Description : IC FLASH 16MBIT PAR 64EASYBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
100+$ 7.1568$ 715.68
110+$ 7.0560$ 776.16
210+$ 6.8544$ 1439.42
500+$ 6.7032$ 3351.6
1000+$ 6.4512$ 6451.2
In Stock: 1493
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.1568
Total :$ 7.16
Delivery :
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PC28F160C3BD70A information

  • Rochester Electronics PC28F160C3BD70A technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-TBGA
  • Technology:FLASH - Boot Block
  • Supplier Device Package:64-EasyBGA (10x13)
  • Memory Size:16Mb (1M x 16)
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:-
  • Access Time:70 ns
  • Memory Format:Flash
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:70ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
PC28F160C3BD70A provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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