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Rochester Electronics MIC59P60YWM
Manufacturer # :MIC59P60YWM
Manufacturer :Rochester Electronics
Dasenic # :MIC59P60YWM-DS
Datasheet : MIC59P60YWM Datasheet
Customer # :
Description : 8-BIT SERIAL-INPUT PROTECTED LAT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6954
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.14
Total :$ 4.14
Delivery :
Payment :
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MIC59P60YWM information
Rochester Electronics MIC59P60YWM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Status Flag
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.295", 7.50mm Width)
- Input Type:-
- Output Type:Bipolar
- Interface:Strobe, Serial
- Supplier Device Package:20-SOIC
- Ratio - Input: Output:1:8
- Voltage - Supply ( Vcc/ Vdd):-
- Number of Outputs:8
- Fault Protection:Current Limiting (Fixed), Over Temperature, UVLO
- Output Configuration:Low Side
- Rds On ( Typ):-
- Voltage - Load:5V ~ 12V
- Current - Output ( Max):500mA
- Switch Type:Latched Driver
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MIC59P60YWM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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