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Rochester Electronics MIC5200-3.3BMM
Manufacturer # :MIC5200-3.3BMM
Manufacturer :Rochester Electronics
Dasenic # :MIC5200-3.3BMM-DS
Datasheet : MIC5200-3.3BMM Datasheet
Customer # :
Description : IC REG LINEAR 3.3V 100MA 8MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7335
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.471
Total :$ 0.47
Delivery :
Payment :
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MIC5200-3.3BMM information
Rochester Electronics MIC5200-3.3BMM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Linear
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Output Type:Fixed
- Voltage - Input ( Max):26V
- Supplier Device Package:8-MSOP
- Current - Supply ( Max):1.5 mA
- Current - Output:100mA
- Current - Quiescent ( Iq):350 µA
- Control Features:Enable
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):3.3V
- Voltage - Output ( Max):-
- Number of Regulators:1
- Voltage Dropout ( Max):0.35V @ 100mA
- P S R R:-
- Protection Features:Over Current, Over Temperature
- EU RoHS Status:RoHS non-compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MIC5200-3.3BMM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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