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Rochester Electronics MIC2595-2BM

HOT SWAP POWER CONTROLLER
part number has RoHS
Manufacturer # :MIC2595-2BM
Manufacturer :Rochester Electronics
Dasenic # :MIC2595-2BM-DS
Customer # :
Description : HOT SWAP POWER CONTROLLER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.1590$ 3.16
25+$ 3.0960$ 77.4
100+$ 2.9700$ 297
500+$ 2.8440$ 1422
1000+$ 2.6820$ 2682
In Stock: 5112
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.159
Total :$ 3.16
Delivery :
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Payment :
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MIC2595-2BM information

  • Rochester Electronics MIC2595-2BM technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:Latched Fault
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Current - Supply:4 mA
  • Type:Hot Swap Controller, Sequencer
  • Number of Channels:1
  • Supplier Device Package:14-SOIC
  • Internal Switch(s):No
  • Voltage - Supply:-80V ~ -19V
  • Programmable Features:Current Limit, Fault Timeout, UVLO
  • Current - Output ( Max):-
  • Applications:-48V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MIC2595-2BM provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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