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Rochester Electronics MIC2583-MBQS

HOT SWAP CONTROLLER
part number has RoHS
Manufacturer # :MIC2583-MBQS
Manufacturer :Rochester Electronics
Dasenic # :MIC2583-MBQS-DS
Customer # :
Description : HOT SWAP CONTROLLER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.1790$ 1.18
25+$ 1.1520$ 28.8
100+$ 1.1070$ 110.7
500+$ 1.0620$ 531
1000+$ 0.9990$ 999
In Stock: 3774
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.179
Total :$ 1.18
Delivery :
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Payment :
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MIC2583-MBQS information

  • Rochester Electronics MIC2583-MBQS technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:Latched Fault
  • Mounting Type:Surface Mount
  • Package / Case:16-SSOP (0.154", 3.90mm Width)
  • Current - Supply:1.5 mA
  • Type:Hot Swap Controller
  • Number of Channels:1
  • Supplier Device Package:16-QSOP
  • Internal Switch(s):No
  • Voltage - Supply:2.3V ~ 13.2V
  • Programmable Features:Fault Timeout, Slew Rate, UVLO
  • Current - Output ( Max):-
  • Applications:General Purpose
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MIC2583-MBQS provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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