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Rochester Electronics MIC2537-1BM
Manufacturer # :MIC2537-1BM
Manufacturer :Rochester Electronics
Dasenic # :MIC2537-1BM-DS
Datasheet : MIC2537-1BM Datasheet
Customer # :
Description : QUAD POWER DISTRIBUTION SWITCH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 4446
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5753
Total :$ 0.58
Delivery :
Payment :
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MIC2537-1BM information
Rochester Electronics MIC2537-1BM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Slew Rate Controlled, Status Flag
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Input Type:Non-Inverting
- Output Type:N-Channel
- Interface:On/Off
- Supplier Device Package:16-SOIC
- Ratio - Input: Output:1:4
- Voltage - Supply ( Vcc/ Vdd):Not Required
- Number of Outputs:4
- Fault Protection:Current Limiting (Fixed), Over Temperature
- Output Configuration:High Side
- Rds On ( Typ):425mOhm
- Voltage - Load:3V ~ 5.5V
- Current - Output ( Max):150mA
- Switch Type:USB Switch
- EU RoHS Status:RoHS non-compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MIC2537-1BM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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