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Rochester Electronics ATZB-S1-256-3-0-C

ZIGBIT 2.4GHZ SINGLE CHIP WIRELE
part number has RoHS
Manufacturer # :ATZB-S1-256-3-0-C
Manufacturer :Rochester Electronics
Dasenic # :ATZB-S1-256-3-0-C-DS
Customer # :
Description : ZIGBIT 2.4GHZ SINGLE CHIP WIRELE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
13+$ 50.7000$ 659.1
In Stock: 964
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 50.7
Total :$ 50.70
Delivery :
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Payment :
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ATZB-S1-256-3-0-C information

  • Rochester Electronics ATZB-S1-256-3-0-C technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Transceiver Modules and Modems
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:Module
  • Frequency:2.4GHz
  • Sensitivity:-97dBm
  • Utilized I C / Part:-
  • Memory Size:256kB Flash, 8kB EEPROM, 32kB SRAM
  • Voltage - Supply:1.8V ~ 3.6V
  • Power - Output:3.5dBm
  • Protocol:Zigbee®
  • Data Rate:2Mbps
  • Serial Interfaces:ISP, JTAG, SPI, UART, USART
  • R F Family/ Standard:802.15.4
  • Antenna Type:Integrated, Chip
  • Current - Receiving:9.6mA ~ 17mA
  • Modulation:-
  • Current - Transmitting:9.9mA ~ 16.3mA
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ATZB-S1-256-3-0-C provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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