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Rochester Electronics ATWILC1000-MR110PA
Manufacturer # :ATWILC1000-MR110PA
Manufacturer :Rochester Electronics
Dasenic # :ATWILC1000-MR110PA-DS
Datasheet : ATWILC1000-MR110PA Datasheet
Customer # :
Description : MICROPROCESSOR CIRCUIT, CMOS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1570
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.762
Total :$ 12.76
Delivery :
Payment :
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ATWILC1000-MR110PA information
Rochester Electronics ATWILC1000-MR110PA technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver Modules and Modems
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:Module
- Frequency:2.412GHz ~ 2.4835GHz
- Sensitivity:-98dBm
- Utilized I C / Part:-
- Memory Size:128kB ROM, 224kB RAM
- Voltage - Supply:3V ~ 4.2V
- Power - Output:19dBm
- Protocol:802.11b/g/n
- Data Rate:72.2Mbps
- Serial Interfaces:I²C, SDIO, SPI, UART
- R F Family/ Standard:WiFi
- Antenna Type:Integrated, Trace
- Current - Receiving:29mA ~ 68mA
- Modulation:16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK
- Current - Transmitting:29mA ~ 230mA
- EU RoHS Status:ROHS3 Compliant
- US ECCN:5A992C
- HTS US:8542.31.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ATWILC1000-MR110PA provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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