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Rochester Electronics AT97SC3205-X3A15-10

TRUSTED PLATFORM MODULE, AVR RIS
part number has RoHS
Manufacturer # :AT97SC3205-X3A15-10
Manufacturer :Rochester Electronics
Dasenic # :AT97SC3205-X3A15-10-DS
Customer # :
Description : TRUSTED PLATFORM MODULE, AVR RIS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.6720$ 3.67
25+$ 3.6000$ 90
100+$ 3.4560$ 345.6
500+$ 3.3030$ 1651.5
1000+$ 3.1230$ 3123
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.672
Total :$ 3.67
Delivery :
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Payment :
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AT97SC3205-X3A15-10 information

  • Rochester Electronics AT97SC3205-X3A15-10 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:28-TSSOP (0.173", 4.40mm Width)
  • Interface:SPI
  • Supplier Device Package:28-TSSOP
  • Voltage - Supply:3.3V
  • Number of I/ O:4
  • Core Processor:AVR
  • R A M Size:-
  • Program Memory Type:EEPROM
  • Controller Series:-
  • Applications:Trusted Platform Module (TPM)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AT97SC3205-X3A15-10 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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