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Rochester Electronics AT93C66A-10TU-1.8

IC EEPROM 4KBIT SPI 2MHZ 8TSSOP
part number has RoHS
Manufacturer # :AT93C66A-10TU-1.8
Manufacturer :Rochester Electronics
Dasenic # :AT93C66A-10TU-1.8-DS
Customer # :
Description : IC EEPROM 4KBIT SPI 2MHZ 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.3705$ 0.37
25+$ 0.3632$ 9.08
100+$ 0.3483$ 34.83
500+$ 0.3335$ 166.75
1000+$ 0.3149$ 314.9
In Stock: 27604
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3705
Total :$ 0.37
Delivery :
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AT93C66A-10TU-1.8 information

  • Rochester Electronics AT93C66A-10TU-1.8 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP (0.173", 4.40mm Width)
  • Technology:EEPROM
  • Supplier Device Package:8-TSSOP
  • Memory Size:4Kb (512 x 8, 256 x 16)
  • Memory Type:Non-Volatile
  • Voltage - Supply:1.8V ~ 5.5V
  • Clock Frequency:2 MHz
  • Access Time:-
  • Memory Format:EEPROM
  • Memory Interface:SPI
  • Write Cycle Time - Word, Page:10ms
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.32.0051
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AT93C66A-10TU-1.8 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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