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  • Rochester Electronics AT34C02-10TI-2.7

    IC EEPROM 2KBIT I2C 8TSSOP
  • part number has RoHS
  • Mfr.Part # :AT34C02-10TI-2.7
  • Manufacturer :Rochester Electronics
  • Dasenic # :AT34C02-10TI-2.7-DS
  • Datasheet :pdf download AT34C02-10TI-2.7 Datasheet
  • Description : IC EEPROM 2KBIT I2C 8TSSOP
  • Package :-
  • Quantity :
    Unit Price : $ 0.4583Total : $ 0.46
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 12000
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.4583$ 0.46
25 +$ 0.4491$ 11.23
100 +$ 0.4307$ 43.07
500 +$ 0.4125$ 206.25
1000 +$ 0.3895$ 389.50

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Rochester Electronics AT34C02-10TI-2.7 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Memory Integrated Circuit
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-TSSOP (0.173", 4.40mm Width)
Technology:EEPROM
Supplier Device Package:8-TSSOP
Memory Size:2Kb (256 x 8)
Memory Type:Non-Volatile
Voltage - Supply:2.7V ~ 5.5V
Clock Frequency:400 kHz
Access Time:900 ns
Memory Format:EEPROM
Memory Interface:I²C
Write Cycle Time - Word, Page:10ms
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AT34C02-10TI-2.7 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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