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Rochester Electronics AT25128-10PC-2.7

IC EEPROM 128KBIT SPI 3MHZ 8DIP
part number has RoHS
Manufacturer # :AT25128-10PC-2.7
Manufacturer :Rochester Electronics
Dasenic # :AT25128-10PC-2.7-DS
Customer # :
Description : IC EEPROM 128KBIT SPI 3MHZ 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.4400$ 1.44
25+$ 1.4130$ 35.33
100+$ 1.3590$ 135.9
500+$ 1.2960$ 648
1000+$ 1.2240$ 1224
In Stock: 12525
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.44
Total :$ 1.44
Delivery :
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AT25128-10PC-2.7 information

  • Rochester Electronics AT25128-10PC-2.7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Technology:EEPROM
  • Supplier Device Package:8-PDIP
  • Memory Size:128Kb (16K x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 5.5V
  • Clock Frequency:3 MHz
  • Access Time:-
  • Memory Format:EEPROM
  • Memory Interface:SPI
  • Write Cycle Time - Word, Page:5ms
  • EU RoHS Status:RoHS non-compliant
  • US ECCN:EAR99
  • HTS US:8542.32.0051
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AT25128-10PC-2.7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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