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Rochester Electronics AT24C512BY7-YH-T

IC EEPROM 512KBIT I2C 1MHZ 8UDFN
part number has RoHS
Manufacturer # :AT24C512BY7-YH-T
Manufacturer :Rochester Electronics
Dasenic # :AT24C512BY7-YH-T-DS
Customer # :
Description : IC EEPROM 512KBIT I2C 1MHZ 8UDFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.4670$ 1.47
25+$ 1.4400$ 36
100+$ 1.3770$ 137.7
500+$ 1.3230$ 661.5
1000+$ 1.2510$ 1251
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.467
Total :$ 1.47
Delivery :
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Payment :
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AT24C512BY7-YH-T information

  • Rochester Electronics AT24C512BY7-YH-T technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-UDFN Exposed Pad
  • Technology:EEPROM
  • Supplier Device Package:8-UDFN (6x4.9)
  • Memory Size:512Kb (64K x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:1.8V ~ 3.6V
  • Clock Frequency:1 MHz
  • Access Time:900 ns
  • Memory Format:EEPROM
  • Memory Interface:I²C
  • Write Cycle Time - Word, Page:5ms
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.32.0051
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AT24C512BY7-YH-T provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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